Potting Compound 110 (Part A & B) – Silicone Based Encapsulant for Electronics (1kg Each)

Potting Compound 110 is a two-part silicone-based encapsulant, designed for high-performance protection of electronic components. Comprising Part-A (Grey) and Part-B (White), this compound offers excellent electrical insulation, flexibility, and resistance to moisture, vibration, and thermal cycling. Once mixed and cured, it forms a durable, rubber-like protective layer ideal for sensitive circuits, PCBs, LED drivers, power supplies, and more.Features of Potting Compound 110:Two-part silicone formulation (Grey + White)High dielectric strength and flexibilityStrong moisture, thermal, and chemical resistanceExcellent adhesion to metals, plastics, and PCBsLow shrinkage and good flow characteristics for easy applicationSpecifications:PropertySpecifications/ConditionsResultsAppearance – Part A-White FluidAppearance – Part B-Grey FluidViscosity Part ACentipoise2500 – 3200Viscosity Part BCentipoise2500 – 3200Density Part Agm/cc1.5 – 1.65Density Part Bgm/cc1.5 – 1.65After Mix PropertiesPropertySpecifications/ConditionsResultsMixing RatioBy Weight1:1Mixing RatioBy Volume1:1Mixed ViscosityCentipoise2500 – 3200Working Time @ 30°CMinutes40 – 60Curing Time @ 30°CHours15– 20Curing Time @ 80°CMinutes120HardnessShore A>40Thermal ConductivityW/mK0.8Dielectric StrengthkV/mm>21Flammability RatingUL 94V0 Compliant Application Process:Surface should be clean before use.Ensure component A and component B are homogenised well before mixing.Mix both component A and component B in the ratio of 1: 1 by weight or by volume.Pour the mixture into the desired container ensuring there is minimal air entrapment.Pouring/dispensing should be done under vacuum if the electronic module being potted has many voids. Leave the mixture to cure at room temperature or at an elevated temperature for faster cure. Package Includes:1 x Potting Compound 110 – Part A (Grey, 1kg)1 x Potting Compound 110 – Part B (White, 1kg)

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